Huang Zhaoling | 2D Materials | Research Excellence Award

Assoc. Prof. Dr. Huang Zhaoling | 2D Materials | Research Excellence Award

Guilin University of Electronic Technology | China

Dr. Zhaoling Huang is an Associate Professor and Master’s Supervisor at Guilin University of Electronic Technology, where he also serves as Deputy Director of the Microelectronics Packaging and Assembly Technology Research Team and a core member of the Ministry of Education Engineering Research Center for Electronic Information Materials and Devices. He holds a Doctor of Engineering degree and has received interdisciplinary training in mechanical engineering, micro-nano biomedical engineering, and electronic manufacturing. His academic and professional experience spans postdoctoral research, industry consultancy, enterprise technology commissioning, and visiting scholarship at leading national universities. Dr. Huang’s teaching portfolio includes undergraduate and graduate courses in circuits, sensors, optoelectronic measurement, electronic technology, and electronic manufacturing processes, with consistently excellent teaching evaluations. His research focuses on electronic packaging interconnect design, reliability of power semiconductor devices, tactile and flexible electronic sensors, MEMS devices, biomedical microdevices, micro- and nanomaterials, surface coating processes, pressure sensing, and multiphysics simulations. He has actively promoted the transformation of scientific achievements through patent transfer and industry collaboration. Dr. Huang has received numerous academic, teaching, and innovation honors and serves as a reviewer and editorial board member for multiple international journals. He is also deeply committed to talent cultivation, having guided students to national and provincial awards in innovation, design, and research competitions, contributing significantly to advanced engineering education and applied research.

Citation Metrics (Scopus)

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Citations
387

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23

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Featured Publications


Biomimetic pyrolytic MXene-based multifunctional films with multi-level structure for wearable piezoresistive devices and bioelectronics

– Advanced Functional Materials

Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn-52In/Cu solder joints during electromigration

– Intermetallics

Recent Progress in Multi-Scale Piezoresistive Interfaces for MXene-Based Flexible Sensors

– Advanced Materials Technologies

Challenges and Opportunities of Implantable Neural Interfaces: From Material, Electrochemical and Biological Perspectives

– Advanced Functional Materials

Multi-scale GO/CNT/AlN Nanocomposites for High-Performance Flexible Electrothermal Film Heaters

– Journal of Materials Chemistry 

Huatao Wang | Materials | Research Excellence Award

Dr. Huatao Wang | Materials | Research Excellence Award

Harbin Institute of Technology WeiHai | China

Huatao Wang is a Professor at the Harbin Institute of Technology, Weihai, specializing in advanced thermal management and functional materials for next-generation electronic systems. His research focuses on thermal management technologies for high-power density electronic products, including IGBT module packaging, high-performance thermal interface materials, and thermally conductive films that enhance heat dissipation and device reliability. He is also actively engaged in the development of flexible electronic sub-devices, encompassing flexible sensors, drivers, and energy storage systems aimed at emerging wearable and adaptable technologies. In parallel, his work on controllable nanomaterial preparation addresses material design at the micro- and nanoscale to achieve optimized thermal, mechanical, and electrical performance. Professor Wang has completed and is currently leading more than ten research projects and holds over ten patents, reflecting his strong emphasis on practical innovation and technology transfer. His scholarly contributions include publications in internationally recognized journals, with notable work on porous graphene foam thermal interface materials demonstrating high compressibility and superior interfacial conformability. Through his integrated approach to materials engineering and device-level applications, Professor Wang continues to advance efficient thermal solutions and multifunctional materials for high-performance and flexible electronic systems.

Citation Metrics (Scopus)

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2,875

Documents
69

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Featured Publications